Thursday, May 8, 2008

Show us the money

Much to the relief of the equipment companies, the chipmakers seem to be shouldering the burden of the 450-mm wafer transition. Intel, Samsung, and TSMC have agreed on a common timeline, targeting production by 2014.

The 300-mm transition, you'll recall, created a lot of bad blood between the supplier and customer camps. The fabs pushed for an aggressive timeline, but (due to the dot com bust) failed to actually buy the equipment once it appeared. Oops. As a result, SEMI members have been pushing back hard at aggressive 450-mm proposals.

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