I've had my differences with Robert Castellano in the past, but I think his view of the proposed 450-mm wafer transition is pretty accurate. The switch to 300-mm wafers was great for the chip companies, not so great for the equipment companies. So there are likely to be some tough negotiations about development funding and equipment purchase commitments before 450-mm equipment moves forward.
The bottom line, though, is that fighting with your customers is never a winning strategy. If big customers like Intel and Samsung are determined to build 450-mm fabs, the equipment companies who help them do it will be more successful than those who can't or won't.